ROHM Semiconductor has introduced new automotive MOSFETs designed to meet the evolving demands of electric vehicle (EV) components. The company is expanding its range of 40 V and 60 V devices by incorporating them into the newly developed HPLF5060 package, a compact solution measuring 4.9 mm by 6.0 mm.
Addressing Miniaturization Challenges in Automotive Power Electronics
The automotive industry is witnessing a significant trend towards smaller component footprints, particularly in power electronics. As semiconductor packages shrink to sizes like the 5060 (5.0 mm x 6.0 mm) and smaller, manufacturers often face challenges in maintaining board-mount reliability. This is due to factors such as narrower terminal spacing and the absence of traditional leads in some designs.
ROHM’s new HPLF5060 package is engineered to overcome these obstacles. While offering a reduced footprint compared to the widely adopted TO-252 package (which measures 6.6 mm x 10.0 mm), it incorporates gull-wing leads. This design feature is crucial for enhancing mounting reliability on printed circuit boards, ensuring a robust connection even in demanding automotive environments.
Key Applications and Technological Advancements
The new MOSFETs, housed in the HPLF5060 package, are targeted for critical applications within electric vehicles. These include the main inverter control circuits, which are central to managing power flow from the battery to the electric motor. Additionally, they are suitable for electric pumps, essential for various vehicle systems, and LED headlights, a growing standard in modern automotive lighting.
A key technological advancement highlighted by ROHM is the use of copper clip junction technology. This innovation enables the devices to handle high-current operations, a necessity for many automotive power applications where efficient and reliable current management is paramount.
Availability and Future Developments
Mass production of the MOSFETs within the HPLF5060 package commenced in November 2025. ROHM has confirmed that these new components are now available for purchase through online channels, including major distributors such as DigiKey and Farnell. This ensures accessibility for automotive manufacturers and system designers globally.
Upcoming Package Innovations
Looking ahead, ROHM is committed to further innovation in power semiconductor packaging. The company plans to initiate mass production of its even more compact DFN3333 package, measuring 3.3 mm by 3.3 mm, around February 2026. This package will feature wettable flank technology, which improves solder joint reliability and inspectability.
Furthermore, ROHM has begun the development of a larger package, designated TOLG (TO-leaded with gull-wing). This package, sized at 9.9 mm by 11.7 mm, is being designed with high-power and high-reliability applications in mind, indicating ROHM’s strategy to cater to a broad spectrum of automotive power requirements.
Impact on Electric Vehicle Engineering
The introduction of these advanced MOSFETs and packages by ROHM signifies a continuous push towards greater efficiency, reliability, and miniaturization in EV power electronics. As electric vehicles become more prevalent, the demand for sophisticated components that can withstand harsh operating conditions while enabling smaller, lighter, and more cost-effective designs will only increase. ROHM’s latest offerings are positioned to address these critical industry needs, supporting the ongoing advancement of e-mobility technology.